Teledyne Relays Announces Series SGRF312 Broadband Surface-Mount Relays
HAWTHORNE, Calif. (July, 2009) - Teledyne Relays has introduced the SGRF312 family of ultraminiature broadband TO-5 relays, featuring a practical surface-mount solution that simplifies circuit-board manufacturing.
The SGRF312 is a formed lead version of Teledyne's GRF312 relays and feature a unique ground shield. They provide easy solder inspection and can be easily removed with hand tools, unlike similar RF devices that simply offer formed leads. Because the relays are hermetically sealed, they can be submerged in cleaning solvents during manufacturing processes.
These ultraminiature surface-mount relays employ a J-lead mounting scheme. They also feature a unique ground shield that insulates and shields each lead to ensure excellent contact-to-contact and pole-to-pole isolation. This ground shield also provides a ground interface that result in overall improved high-frequency performance.
Like previous broadband TO-5 relays from Teledyne Relays, the dual-pole, dual-throw (DPDT) SGRF312 deliver a high number of switching cycles as well as excellent RF parameters and repeatability.
They cover frequencies from DC to 8 GHz. The relays also are characterized by low energy consumption and performance over a wide temperature range of -65°C to +125°C.
The SGRF312 is suited for many high-speed digital switching applications, including test and measurement equipment and high-volume semiconductor manufacturing test environments.
The SGRF312 employs a round form factor. The SGRF312 measures .035 inches (8.51 mm) in diameter and .390 inches (9.91 mm) in height (excluding leads). It weighs 0.09 oz. (2.55 g).
For more information, call (800) 284-7007 www.teledynerelays.com or send e-mail to
relays@teledyne.com.
For the latest news releases, visit http://www.teledynerelays.com/newsrelease.asp. For the latest data sheets, visit http://www.teledynerelays.com/pdf/electromechanical/sgrf312.pdf.
Teledyne Relays, a Unit of Teledyne Electronics and Communications, has been the world's innovative leader in manufacturing ultraminiature, hermetically sealed, electromechanical and solid-state switching products for more than 40 years. The company's comprehensive product line meets a wide range of requirements for industrial, commercial, RF & microwave, communications, test & measurement, medical, military and aerospace uses.